✱Polycrystalline Diamond Powder
Polycrystalline Diamond Powder is produced in a controlled explosion. Under the microscope, the granular structure is shown on the left. PCD has more facets than single crystals. Therefore, better removal rate and better self-sharpening can be obtained.These characteristics provide solutions for the rapid grinding and polishing of some high hardness special materials. Experiments show that the removal rate of poly diamond is 2- 4 times higher than common diamond and without scratches.
Available Sizes
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Specification |
0-1 |
1-2 |
1-3 |
2-4 |
2-5 |
3-6 |
4-8 |
5-10 |
6-12 |
8-12 |
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✱Quasi-Polycrystalline diamond powder
The particle shape is porous structure, and the surface has a large number of sharp cutting edges. Strong removal rate,no scraches, high grinding efficiency which can reach 2-4 times of the monocrystalline diamond powder. After grinding and polishing, the surface Ra value is significantly reduced, which is widely used in precision grinding and polishing of hard and brittle materials, such as sapphire, silicon carbide crystal and ceramic materials.
Available Sizes
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Specification
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0-2 |
1-3 |
2-4 |
3-6 |
4-8 |
5-10 |
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6-12 |
8-16 |
10-20 |
15-25 |
20-30 |
30-40 |
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¡ï Diamond powder for PCD/PDC
The raw material is made of high-strength MBD. Compared with the traditional micropowder, the six-octahedral fine particle MBD can greatly increase the packing density of the powder, increase the amount of diamond per unit volume in the PDC, and improve the bonding of diamond particles in the PDC. The synthesized PDC has much higher wear resistance, impact resistance and heat resistance than the traditional micropowder.In extreme working conditions such as oil drilling and precision machining, the service life and stability of PCD/PDC tools directly determine production efficiency.
Available Sizes
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PCD/PDC special diamond micron powder |
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Ultra-fine grain micropowder |
Fine grain micropowder |
Medium grain micropowder |
Coarse grain micropowder |
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£¼0.5¦Ìm |
0.5-2¦Ìm |
2-20¦Ìm |
20-50¦Ìm |
¡ï Diamond powder for electroplating
Characteristics:Made of higher grade MBD diamond, extremely low intrinsic impurity and special acid & alkali treatment to ensure the total impurity content at PPM level, very good fluidity & dispersity & therm stability.
Applications:Recommended for superior PCD/PDC synthesis, Single layer bond(Electroplated & Brazed system), Metal bond, Hybrid bond diamond tools
¡ï Diamond powder for wire saw
Characteristics:The raw materials are made of high-technology, high-strength MBD series diamond, which is produced by special processing procedures. The crystal shape of the product is more regular, the particle size distribution is extremely concentrated, the effective grinding particles are concentrated, the micro-powder particle strength is high, the impurity content is extremely low, and it has good dispersion and wear resistance.
Application: Suitable for cutting, grinding and polishing of organic and inorganic brittle materials. Such as: wire saw, gem saw blade, semiconductor saw blade and other cutting tools, also suitable for monocrystalline silicon, polysilicon, diamond, gem, sapphire, quartz sheet, LED sapphire substrate, liquid crystal glass, high-precision magnetic materials, semiconductor and other high-tech materials rough grinding, fine grinding, polishing tools.
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